סמינר מחלקתי אלקטרוניקה פיזיקאלית : Boris Vaisband
You are invited to attend a lecture
Framework for Heterogeneous Systems Integration
:By
Boris Vaisband
Center for Heterogeneous Integration and Performance Scaling (CHIPS)
Department of Electrical Engineering, University of California, Los Angeles, CA
Abstract
Integration of heterogeneous technologies and functionalities (i.e., materials, devices, and circuits) within a single platform is imperative to support modern performance requirements. Various platforms have been developed for heterogeneous integration, including interposers, 3-D integrated circuits, wafer-scale integration, flexible and bio-compatible technologies, and others. Enablement of these platforms however, requires solutions on a broad span of hierarchy, from technological innovation in materials and devices, through efficient circuit design, up to novel system-level architectures and methodologies. Research across the aforementioned hierarchy will be presented in this talk for two heterogeneous integration platforms: 3-D integrated circuits and silicon interconnect fabric. Suitable applications for each of these platforms will also be discussed. Some of the obtained results exhibit significant performance improvement over classical approaches in terms of area and power; other presented work outlines a path for enablement of a paradigm shift in heterogeneous integration
On Tuesday, Nov 20, 2018, 15:00
Room 011, Kitot building