סמינר מחלקתי של לינה בורסקי- הנדסה תרמית ב-NVIDIA: כמה מגניב זה?

Monday April 21th 2025 at 14:00 

Wolfson Building of Mechanical Engineering, Room 206 

abstarct: 

Ever thought about the challenges of managing heat in high-performance computing hardware? In this talk, I’ll take you inside the world of thermal engineering at NVIDIA’s Israeli networking unit, where we tackle some of the toughest thermal challenges in the industry.

We’ll dive into the products we develop—from high-speed devices for data centers to optics-based components—and examine the thermal and mechanical engineering processes behind them. You’ll see how we go from concept to production, dealing with extreme power densities, cooling limitations, and innovative thermal solutions.

Finally, I’ll share the key R&D tools and methodologies we use daily, including many concepts you’ve learned in university—and some new ones that were eye-opening for me after joining the industry. Whether you’re considering a career in thermal engineering or just curious about how these systems work, this seminar will give you a real-world look at what it takes to keep NVIDIA’s technology cool under pressure!

bio: 

Lina completed her Mechanical Engineering B.Sc. and M.Sc. in 2023, and has been working as a thermal engineer at NVIDIA ever since.