סמינר מחלקתי אלקטרוניקה פיזיקאלית : John Papapolymerou

You are invited to attend a lecture

?3D Printing for System-on-Package (SoP) RF Front Ends and Antennas or From Printing Legos to RF Components

By

John Papapolymerou

Chairperson/MSU Foundation Professor

Department of Electrical & Computer Engineering

Michigan State University

Abstract

3D Printing has advanced significantly over the last decade with respect to different print technologies and hybridization of these technologies to achieve complex material layering. In addition, there have been advances made in the areas of materials, print resolution and surface finish. Microwave and millimeter wave passive circuits can now readily be printed that provide similar or better performance in comparison to their counterparts that are fabricated using traditional techniques. This presentation will highlight key advances made in this area using two 3D printing technologies: polyjet- and aerosol-jet printing. Several circuits such as waveguides, filters and couplers, antennas, and tunable elements have been investigated, and measured results show that 3D Printing holds significant potential for the fabrication of RF components directly on a substrate and as standalone structures. Both simulation and test results of several example circuits will be presented.

On Sunday, November 12, 2017, 16:00

Room 011, Kitot building