סמינר אלקטרוניקה פיזיקאלית: Yuval Berg

You are invited to attend a lecture
Embedded 3D interconnects in glass substrates by a combined laser trenching and printing process
By:
Yuval Berg
Ph.D. student under supervision of Prof. Yosi Shacham-Diamand

Abstract
Control of grooved structured profiles can be achieved by a femtosecond laser ablation process in different materials – dielectrics, semi-conductors and metals. In addition, high accuracy additive manufacturing techniques, e.g. laser induced forward transfer (LIFT), provide flexibility in 3D printed structures deposited on a variety of substrates.
The combination of those two laser technologies allows the integration of embedded circuitry and other components, such as microfluidic and micromechanical systems, paving the way to a wide range of applications where conventional subtractive patterning is a problem.
Embedding is advantageous in terms of mechanical stability and adherence of the printed metal allowing a favorable aspect ratio and thereby providing improved electrical properties of the conducting lines as well as planar and debris-free surfaces.
In this work I report on a combination of laser grooving and laser printing processes and demonstrate the manufacturing of buried copper structures in a grooved borosilicate glass substrate.
On Monday, March 11, 2019 at 9:30
Room 011, Kitot Building